Precision Laser Cutting Machine for Hard Brittle Materials ML-SC3030

Application

Precision laser cutting machine for hard and brittle materials is mainly used for laser micromachining of ceramic, sapphire, diamond, calcium steel, high hardness and high brittleness plane, regular surface instrument

High Precision Machining

Small cutting seam width :

15 ~ 35um

High machining accuracy :

≤ ± 10um

Good quality of incision :

smooth incision, small heat affected zone, less burr and edge chipping ＜ 15um

Size refinement :

the minimum product size is 100um

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Precision laser cutting machine for hard and brittle materials

Hard and brittle materials precision laser cutting machine can process mainly alumina, diamond, sapphire, zirconia, aluminum nitride, silicon nitride, silicon, gallium arsenide, tungsten steel, etc., mainly flat and curved instruments laser cutting, drilling, grooving, marking and other fine processing technology, such as ceramic forming of mobile phone back cover, MIM watch ring forming, Sapphire drilling, zirconia ceramic marking drilling molding, tungsten steel sheet cutting molding, silicon oxide ceramic drilling, ceramic plate slotting processing and so on.

Equipment parameters

Maximum operating speed	1000mm/s(X) ；1000mm/s(Yl&Y2) ；50mm/s(Z)
Positioning accuracy	±3um（X）±3um（Y1Y2）；±3um（Z）
Repetitive positioning accuracy	±lum (X) ；±lum(Y1&Y2) ；±3um（Z）
Machining material	Alumina & zirconia & aluminum nitride & silicon nitride & Diamond & Sapphire & Silicon & gallium arsenide & tungsten steel, etc
Material wall thickness	0~2.0±0.02 mm
Plane machining range	300mm*300mm；(support customization for larger format requirements)
Laser type	UV fiber laser
Laser wavelength	1030-1070±10nm
Laser power	CW1000W&QCW150W& QCW300W& QCW450W for option
Equipment power supply	220V± 10%, 50Hz；AC 15A (main circuit breaker)
File format	DXF、DWG&Gebar
Equipment dimensions	1280mm1320mm1600mm
Equipment weight	1500Kg

Strong adaptability

Have the ability of laser cutting, drilling, scribing, blind engraving and other fine machining technology for plane & regular curved surface instruments
Can machine FPC & PCB & PET & PI & copper foil & aluminum foil & carbon fiber & glass fiber & composite material & ceramic and other materials
Provide self-developed direct drive XY superposition type & split type fixed gantry precision motion platform & automatic loading and unloading system for option
Provide the function of pre scan of bilateral CCD vision location & automatic target grasping and location
Equipped with precision vacuum adsorption fixture & dust removal pipeline system
Equipped with self-developed 2D & 2.5D CAM software system for laser micromachining

Sample display

MIM watch circle cutting

Zirconium nitride ceramic cutting

Sapphire cutting

Sapphire drilling

Ceramic molding of mobile phone back cover

Ceramic plate slotting

Tungsten steel sheet Cutting

Zirconia ceramic WT0.7mm marking

Silicon oxide ceramic cutting

Flexible design

Follow the design concept of ergonomics, delicate and concise
The combination of software and hardware functions is flexible, supporting personalized function configuration and intelligent production management
Support positive innovation design from component level to system level
Open control & laser micromachining software system easy to operate & intuitive interface