PCB UV Laser Cutting Machine ML-UVM4035

Application

Ultraviolet laser cutting machine is mainly used for PCB laser board splitting and drilling; camera, fingerprint identification module FPC cutting; soft and hard bonded board uncovering, trimming, cover film window opening; silicon steel sheet, ceramic scribing; ultra-thin Laser cutting and forming processing of composite materials, copper foil, aluminum foil, carbon fiber, glass fiber, etc.

High Precision Machining

Small cutting seam width :

15 ~ 35um

High machining accuracy :

≤ 10um

Good quality of incision :

smooth incision & small heat affected zone & less burr

Size refinement :

minimum product size 50um

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PCB UV laser cutting machine

PCB UV laser cutting machine has fine processing capabilities such as laser cutting, drilling, scribing, blind engraving, etc. for plane and regular curved surface instruments. It can process a variety of materials, such as FPC, PCB, PET, PI, carbon fiber, glass fiber, composite materials, copper foil, aluminum foil, ceramics, etc. The equipment is advanced in design, follows the ergonomic design concept, easy to operate, high processing precision, smooth incision, passed 3C certification, and the quality is assured!

Equipment parameters

Maximum operating speed	500mm/s（X）；500mm/s（Y1Y2）；50mm/s（Z）
Positioning accuracy	±3um（X）±3um（Y1Y2）；±3um（Z）
Repetitive positioning accuracy	±lum (X) ；±lum(Y1&Y2) ；±3um（Z）
Machining material	FPC & PCB & PET & PI & copper foil & aluminum foil & carbon fiber & glass fiber & composite material & ceramic and other materials
Material wall thickness	0~2.0±0.02 mm
Plane machining range	400mm*350mm
Laser type	UV fiber laser
Laser wavelength	355±5nm
Laser power	Nanosecond & picosecond，10W & 15W for option
Laser frequency	10~300KHz
Power stability	< ± 3% (continuous operation for 12 hours)
Equipment power supply	220V± 10%, 50Hz；AC 15A (main circuit breaker)
File format	DXF、DWG&Gebar
Equipment dimensions	1200mm1400mm1800mm
Equipment weight	1500Kg

Strong adaptability

Have the ability of laser cutting, drilling, scribing, blind engraving and other fine machining technology for plane & regular curved surface instruments
Can machine FPC & PCB & PET & PI & copper foil & aluminum foil & carbon fiber & glass fiber & composite material & ceramic and other materials
Provide self-developed direct drive XY superposition type & split type fixed gantry precision motion platform & automatic loading and unloading system for option
Provide the function of pre scan of bilateral CCD vision location & automatic target grasping and location
Equipped with precision vacuum adsorption fixture & dust removal pipeline system
Equipped with self-developed 2D & 2.5D CAM software system for laser micromachining

Sample display

5g copper foil antenna cutting

COF cutting 01

COF cutting 02

FCP cutting 01

FCP cutting 02

FCP cutting 03

FCP cutting 04

Film cutting

Gold plated probe cutting

Flexible design

Follow the design concept of ergonomics, delicate and concise
The combination of software and hardware functions is flexible, supporting personalized function configuration and intelligent production management
Support positive innovation design from component level to system level
Open control & laser micromachining software system easy to operate & intuitive interface