Laser cutting machine for ceramic circuit boards

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With the development of precision microelectronics and industrial fields such as aviation and ships, ceramic substrate circuit boards have been widely used. Because ceramic circuit boards use ceramic materials as substrates, they have superior high-frequency electrical properties, high thermal conductivity, chemical stability, and thermal stability compared to traditional glass fiber substrates. Therefore, ceramic circuit boards can provide more reliable and stable performance when used in high power, high frequency, and special environments. As a result, ceramics have become an ideal foundational material for high-power electronic circuit structures and interconnect technologies. The use of laser cutting machines for processing has become mainstream.

Because ceramics have a high-density structure and a certain degree of brittleness. Under such high hardness, strength, and brittleness conditions, traditional cutting methods are prone to fracture when processing thinner ceramics, which increases the difficulty of cutting and cannot meet the processing requirements. Laser cutting machine is a non-contact processing equipment. As a flexible, high-efficiency, and high-yield processing method, laser has obvious advantages over traditional processing methods in cutting technology, especially in the processing of ceramic substrate circuit boards, demonstrating extraordinary capabilities.

Firstly, the non-contact cutting process of the laser cutting machine ensures that there is no stress inside the product, with minimal edge breakage, high processing accuracy, high yield, and small heat affected zone. So laser cutting is very suitable for ceramics, which are both hard and brittle materials. Moreover, the gap width formed during laser cutting of materials is small, which can save materials. Secondly, the laser spot of the laser cutting machine is small, the energy density is high, which can ensure high-precision cutting, and the incision is smooth with few burrs. Finally, laser cutting machines have the characteristics of stable processing quality, fast speed, and high efficiency, which can achieve large-scale and batch processing, suitable for the vast majority of hard and soft materials, and meet the needs of high-density interconnection and fine development of ceramic circuit boards.

Men Luc has developed a laser cutting machine for micro machining of high hardness and high brittleness materials such as ceramics, diamonds, tungsten steel, etc. It not only performs laser cutting on flat surfaces, but also has fine processing techniques such as laser cutting, drilling, slotting, and marking on flat and regular surfaces. It can also provide high-quality system solutions and equipment configurations according to the processing needs of enterprises.