Laser drilling of LTCC raw ceramic tape

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PCB circuit boards have been widely used in the market for a long time. However, in some products such as resistors, capacitors, and inductors, they are often not applied to PCB boards due to the need for high-temperature sintering. In contrast, ceramic-based substrates have great advantages. In particular, with the development of LTCC low-temperature co-fired ceramic technology, it has been widely used in the development of high-frequency, high-performance and highly integrated electronic components.

LTCC technology forms an integrated ceramic multilayer material by stacking the cast ceramic materials together as required and printing interconnecting conductors, components and circuits inside. It mainly includes steps such as casting, punching, filling, lamination, slicing, co-firing and inspection. Since the aperture and position accuracy of the through hole affect the yield and final electrical properties of the substrate, drilling on the raw ceramic sheet is one of the key processes in the LTCC production process. Raw ceramic tape can be punched by drilling, punching or laser drilling. The following briefly introduces the advantages of laser cutting machine for punching raw ceramic tape.

Laser cutting machines for hard and brittle materials can be used for precision drilling. Laser cutting machines use a high-energy-density laser beam to focus on the green body, and achieve drilling by generating ultra-high temperatures to vaporize the material; this will hardly cause cracks or edge splashing, and the edges are smooth and flat; thus ensuring better bonding with the metal and providing product performance assurance.

As a professional laser equipment manufacturer, men-luck’s main products include laser marking machines, laser cutting machines, laser welding machines, etc., which can be combined with assembly line automation to provide high-quality laser equipment and personalized system solutions. Customers with needs are welcome to contact us.