Breakthrough application of laser cutting machine in processing hard and brittle materials

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Hard and brittle materials (such as glass, ceramics, sapphire, single crystal silicon, etc.) are widely used in electronics, optics, semiconductors and other fields due to their high hardness and wear resistance. However, their high brittleness and easy cracking make traditional mechanical processing face huge challenges. Laser cutting machines provide efficient and low-loss solutions for hard and brittle materials through non-contact processing and precise energy control, promoting the upgrading of related industries.

Breakthrough application of laser cutting machine in processing hard and brittle materials-Medical femtosecond stent laser cutting machine, mainly used for laser cutting, punching and forming of precision metal tubes such as medical stents, Hypotube, Endoscope Bending Section | Men-Luck

Traditional wheel cutting or CNC processing is prone to produce microcracks or edge collapse on the surface of glass and ceramics, resulting in a yield of less than 60%. Laser cutting uses femtosecond/picosecond ultrafast pulse lasers to form an extremely narrow heat-affected zone inside the material, with a smooth and flat incision and an edge collapse size of less than 10μm. For example, the curved glass cover of smartphones is cut by ultraviolet laser, and the edge strength is increased by 40%, meeting the demand for precision appearance of 3C products.

Laser cutting can break through the structural limitations of hard and brittle materials and realize micro-holes, curves and three-dimensional special-shaped processing. In the field of Micro LED, laser technology can cut a 50μm diameter microhole array on a 0.2mm thick sapphire substrate with an accuracy of ±2μm. In addition, the fine grooving and segmentation of ceramic circuit substrates also rely on laser processing to avoid stress damage of traditional board splitters.

Breakthrough application of laser cutting machine in processing hard and brittle materials-Medical femtosecond stent laser cutting machine, mainly used for laser cutting, punching and forming of precision metal tubes such as medical stents, Hypotube, Endoscope Bending Section | Men-Luck

From photovoltaic silicon wafers to aerospace ceramic coatings, laser cutting adapts to different materials through intelligent adjustment of wavelength and power. For example, the cutting speed of picosecond laser for aluminum nitride ceramics can reach 300mm/s, which is 5 times more efficient than traditional processes and has no tool loss.

As a professional laser equipment manufacturer, MenLuck focuses on the research and development of high-precision laser cutting equipment, providing customized solutions for 200+ segmented scenarios such as 3C electronic precision structural parts, medical surgical instruments, home appliance hardware and other high-precision processing. Welcome to contact us if you have any needs: E-mail: info@menlaser.com

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