Under the trend of miniaturization and high frequency of electronic equipment, the line width of circuit boards has exceeded the limit of 50μm, and traditional mechanical processing faces bottlenecks such as edge collapse and burrs. Laser cutting technology has become an innovative tool for the manufacture of HDI boards and flexible circuit boards with its non-contact and high-precision characteristics, redefining the processing standards of electronic components.

The UV laser cutting machine uses a 355nm short-wavelength light source, and the focused spot diameter can reach 15μm, which can realize φ30μm micro-via processing on the FR-4 substrate, and the accuracy is 5 times higher than that of a mechanical drilling machine. Femtosecond laser technology controls the heat-affected zone within 3μm through 10^-15 second ultra-short pulses, perfectly cuts polyimide cover film without damaging the underlying copper foil, and the yield rate is increased to 99.8%.
The UV laser cutting machine equipped with a CCD visual positioning system can automatically identify the circuit board mark points and complete the engraving of an antenna array with a line width of 0.08mm on a 0.1mm thick ceramic substrate. For 10-layer high-density interconnect boards, the picosecond UV laser cutting machine can achieve a blind groove cutting depth error of ±5μm, meeting the impedance consistency requirements of 5G communication modules.
As semiconductor packaging technology evolves towards 3D structures, laser cutting machines are moving towards multi-wavelength composite processing. This technology not only supports the continuous evolution of smartphones and IoT devices, but also opens up a new dimension of precision manufacturing in aerospace electronics, medical implants and other fields.

MenLuck is a professional laser cutting machine manufacturer that provides different types of laser cutting machines for the needs of enterprises in different industries, which are widely used in 3C, medical, hardware, home appliances, etc. Enterprises with needs for laser processing are welcome to contact us. E-mail: info@menlaser.com
Selecting Laser Cutting Machine Configurations Based on Application 2026-11-12
Different processing applications impose distinct requirements on fiber laser cutting machines. A reliable approach to equipment selection is to first analyze the workpieces, then evaluate the technical specifications. For thin-sheet batch components—such as enclosures o…
Key points for selecting fiber laser cutting machine for cutting thick carbon steel plates 2026-10-21
The cutting of thick carbon steel plates is a key concern for many equipment supervisors in metal processing plants. Traditional plasma cutting has a rough cross-section and requires a large amount of subsequent processing; The performance of fiber laser cutting machines in the…
Fiber Laser Cutting Machine: Addressing Stainless Steel Slag Adhesion 2026-09-29
In stainless steel cutting, slag hanging and burrs are common issues in sheet metal workshops, which not only increase grinding time but also affect workpiece accuracy and delivery efficiency. As a laser cutting machine manufacturer, we share several practical suggestions from …
Laser precision cutting machine: the core equipment for semiconductor and communication device manufacturing 2026-08-17
In the field of semiconductor and communication device manufacturing, the limits of accuracy are constantly being rewritten - chip processes are approaching physical limits, 5G base station filter apertures continue to shrink, and tolerances for some key features have entered t…